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  • Wafer Backgrinding Silicon Wafer Thinning Wafer Backgrind

    Wafer backgrinding starts with a large grit wheel to remove most of the surface, and wheels with a finer grit are used to finish polishing the silicon wafer to the desired thickness. To prevent contamination, deionized water is used to wash debris from the surface throughout the wafer thinning process.

  • Double Side Polish Wafer What Wafer Polishing Accomplishes

    Aug 12, 2019  Let’s take a look at how wafer polishing can get rid of surface damage on wafers. Polishing. Polishing is an essential step to get rid of any surface damage and defects caused by backgrinding. Polishing also gives wafers a flat surface with a mirror-like finish on both sides. Thus, the double-side polish wafer.

  • Double Side Polish Wafer The Basics of Chemical ...

    Oct 24, 2019  Backgrinding also helps in removing stresses on the wafers and helps prevent warping, while the post backgrind relief helps prepare silicon wafers for dicing for various electronic applications, especially the ones requiring flexible circuits. Post-backgrind wafer polishing takes away 5-10 microns of silicon from the back part of the wafer.

  • Wafer grinding, ultra thin, TAIKO - dicing-grinding service

    Partial Wafer Grinding is an efficient grinding method to process broken or damaged wafers, or wafer sections. This technique can be employed to process wafers that had been damaged, or wafer sections that are still intact, thereby avoiding loss of the entire wafer material.

  • Wafer Processing, Wafer Reclaim Services - Optim Wafer ...

    Wafer Resizing. Wafer Edge Trimming. Wafer Grinding Dicing. Double Side CMP Polishing for TSV’s or SOI Substrates. Standard product wafer backgrinding. Wafer Thinning Double side polishing for bonding preparation. Wafer Thinning Double side polishing for Fabrication of Sensors. Handle wafer thinning or removal. Layer transfer processing.

  • Wafer backgrinding - Wikipedia

    Wafer backgrinding is a semiconductor device fabrication step during which wafer thickness is reduced to allow stacking and high-density packaging of integrated circuits (IC).. ICs are produced on semiconductor wafers that undergo a multitude of processing steps. The silicon wafers predominantly used today have diameters of 200 and 300 mm. They are roughly 750 μm thick to ensure a minimum

  • Custom Silicon Wafer Back Grinding Services SVM

    Silicon Valley Microelectronics provides grinding on our own substrates or on customer supplied wafers. We process bare and device patterned wafers with high yield and offer wafer thinning to customer specifications. SVM Wafer Back Grinding Capabilities: Diameters: 25mm (1″) – 300mm (12″) Final wafer thickness for 50μm to 200μm: ≥ 50μm

  • Wafer Preparation Wafer Dicing Wafer Backgrinding ...

    Quik-Pak delivers complete wafer preparation services for wafers up to 300mm. Wafer Preparation services are offered as part of your turnkey packaging and assembly project or as stand-alone services based on your individual needs. With our advanced wafer processing equipment, Quik-Pak offers expert backgrinding services for wafer-level packaging.

  • Wafer Dicing Service Wafer Backgrinding Wafer Bonding

    Wafer backgrinding, also referred to as "backlap" or "wafer thinning," is a process in which the backside of a wafer is ground down, producing a thinner wafer that allows more layers and a higher density of integrated circuits to fit in a smaller package. Additional reasons for creating an ultra thin wafer may be for flexibility or heat ...

  • Wafer Back Grinding Tapes - AI Technology, Inc.

    AIT wafer and substrate grinding and thinning temporary bonding adhesive tapes are made in the United States with Company Service Centers in China and USA. The high temperature controlled release tape has a conformable compressible layer of 150 and 300 micron thickness to accommodate bumped wafers with gold or solder bumps respectively.

  • Polishing for die strength, stress relief for thin dies ...

    Dry Polishing. Wafer dry polishing achieves the desired mirror finish to the workpiece ensuring excellent stress relief to the dies and therefore, high die strength for thin and fragile wafers. Dry polishing process is chemical-free and slurry-free. By dry polishing, the damaged layer that is inevitably remaining after grinding, is removed.

  • Wafer Processing, Wafer Reclaim Services - Optim Wafer ...

    Wafer Resizing. Wafer Edge Trimming. Wafer Grinding Dicing. Double Side CMP Polishing for TSV’s or SOI Substrates. Standard product wafer backgrinding. Wafer Thinning Double side polishing for bonding preparation. Wafer Thinning Double side polishing for Fabrication of Sensors. Handle wafer thinning or removal. Layer transfer processing.

  • Semiconductor wafer backgrinding and shaping

    Valley Design East Phoenix Park Business Center 2 Shaker Road, Bldg. E-001 Shirley, MA 01464 Phone: 978.425.3030 Fax: 978.425.3031 Valley Design West Santa Cruz, CA 95060

  • Wafer Lapping - Polishing Machines PR Hoffman Wafer ...

    Wafer Lapping and Polishing info. PR Hoffman Machine Products is an industry leader in wafer lapping and polishing machines and consumables. Please take a minute and review the self-guided outline below that will help lead you to additional resources to enhance your wafer lapping and polishing

  • Backgrinding - Desert Silicon

    Backgrinding is the process of removal of silicon from the back of wafers following conventional semiconductor processing. The process is primarily utilized in thinning wafers for commercial semiconductor wafer fabs. Wafers are first laminated using an automatic taping machine. After inspection, they are placed on a Disco 84X series infeed grinder.

  • Amkor Technology Services SourceESB

    Amkor Technology company details: SourceESB has found 15 Products Services, 3 Locations associated to Amkor Technology

  • Wafer Backgrind/Polishing Services cover 300 mm processes.

    Nov 15, 2013  This complements existing 300 mm dicing saws to provide comprehensive 300 mm die prep solution. Backgrind and polishing services cover polygrind to 50 µm on up to 300 mm wafers, individual die thinning, irregular shapes and wafer sizes, exotic materials (SiGe, GaN, GaAs, SiC, sapphire, glass), and multiple backside finishes and backgrind tapes.

  • Wafer Back Grinding Tapes - AI Technology, Inc.

    AIT wafer and substrate grinding and thinning temporary bonding adhesive tapes are made in the United States with Company Service Centers in China and USA. The high temperature controlled release tape has a conformable compressible layer of 150 and 300 micron thickness to accommodate bumped wafers with gold or solder bumps respectively.

  • Addison Engineering Services SourceESB

    Addison Engineering company details: SourceESB has found 9 Products Services, 1 Locations associated to Addison Engineering

  • Jeffry Jose Reyes - Singapore Professional Profile ...

    • Equipment and Process Assc Engineer Specializing for Wafer probe test, Wafer saw, Edge trim and Back grind / Polishing process in Global foundries Singapore, process includes full/half wafer sawing (MEMS/CMOS bonded wafers), up to 125um backgrinding Etest. o Setup includes process conversion for half and full dicing.

  • 职位: Currently Applying for Engineer
  • OnChip Offers a Full Service Silicon Wafer Backend ...

    Backgrinding. Backgrinding, lapping, or mechanical polishing are methods used to reduce thickness of wafers to attain a desired size (down to 100 microns or 4 mils) or surface texture (ultra fine finish of 2000-Grit). Proper backside surface finish is key to remove

  • Die And Package Stacking Grow Up Electronic Design

    The package manufacturers need the die in wafer form so they can thin the wafers (through backgrinding and polishing) to the very shallow thicknesses (several mils) required for die stacking ...

  • Silicon Wafers SOI Wafers Custom Wafer Films ...

    UäˆY$BØ8䮇 QÝüa ¯ P9ª €t¿ @Õ"!ó‚Õ ¿þüóߟ À¸ûÿ ‚Ñd¶Xmv G'g W7w O/o _? O¾oZÿßNU>þ1R©ºåhù {ãÄöÙTM2sÇÙ§§¯ $ n @P ...

  • Semiconductor Wafer Polishing and Grinding Equipment ...

    Dec 20, 2017  Semiconductor wafer polishing and grinding equipment vendors need to manufacture robust machines that can support the increasing production of ICs from 2019 onward.” Competitive vendor landscape

  • Wafer Processing, Wafer Reclaim Services - Optim Wafer ...

    Wafer Resizing. Wafer Edge Trimming. Wafer Grinding Dicing. Double Side CMP Polishing for TSV’s or SOI Substrates. Standard product wafer backgrinding. Wafer Thinning Double side polishing for bonding preparation. Wafer Thinning Double side polishing for Fabrication of Sensors. Handle wafer thinning or removal. Layer transfer processing.

  • Wafer Backgrind/Polishing Services cover 300 mm processes.

    Nov 15, 2013  This complements existing 300 mm dicing saws to provide comprehensive 300 mm die prep solution. Backgrind and polishing services cover polygrind to 50 µm on up to 300 mm wafers, individual die thinning, irregular shapes and wafer sizes, exotic materials (SiGe, GaN, GaAs, SiC, sapphire, glass), and multiple backside finishes and backgrind tapes.

  • Wafer Polishing / CMP, Double Side Polishing - Optim Wafer ...

    Optim Wafer Services is able to offer additional Single or Double side polishing of substrates for the following types of applications: Post-thinning of substrates that are required to be a nonstandard thickness. To open Poly filled TSV’s but leave a clean, mirror polished surface. Post-thinning of an SOI wafer or Bonded pair of wafers.

  • Wafer thinning and wafer backgrinding service

    The Valley Design Advantage - Wafer thinning experience spanning over 30 years, hundreds of customers, thousands of successfully completed wafer thinning jobs on numerous types of wafers. Wafer thinning and backgrinding services: (abrasive lapping or Disco backgrinding) Thinning from partial wafer sections up to 300mm diameter wafers

  • silicon wafer edge grinding - Wembley Primary School

    Semiconductor wafer backgrinding and shaping Silicon Wafers. Semiconductor Material Wafer Backgrinding Double side polished wafers to TTV lt 1 micron Silicon Germanium Gallium Arsenide Gallium Phosphide wafer shaping Slicing to 5 quot diameter Wafer edge grinding Lapping to 300 mm diameter wafers Wafer backgrinding lapping polishing Dicing to 6 quot diameter Optical grade

  • Jeffry Jose Reyes - Singapore Professional Profile ...

    • Equipment and Process Assc Engineer Specializing for Wafer probe test, Wafer saw, Edge trim and Back grind / Polishing process in Global foundries Singapore, process includes full/half wafer sawing (MEMS/CMOS bonded wafers), up to 125um backgrinding Etest. o Setup includes process conversion for half and full dicing.

  • 职位: Currently Applying for Engineer
  • Silicon Wafers SOI Wafers Custom Wafer Films ...

    UäˆY$BØ8䮇 QÝüa ¯ P9ª €t¿ @Õ"!ó‚Õ ¿þüóߟ À¸ûÿ ‚Ñd¶Xmv G'g W7w O/o _? O¾oZÿßNU>þ1R©ºåhù {ãÄöÙTM2sÇÙ§§¯ $ n @P ...

  • NanoX-2000 3D surface topography SemiStar

    NanoX-2000 – Sapphire wafer surface roughness analysis: NanoX-2000 – Sapphire wafer polishing analysis via Roughness: NanoX-2000 – Silicon wafer backgrinding surface roughness and defect analysis: NanoX-2000 – Epi layer defect analysis: Epi layer defect analysis;defect:PV~190nm,radius~2.0um: Epi defect analysis,zoom-in 3D view

  • Die And Package Stacking Grow Up Electronic Design

    The package manufacturers need the die in wafer form so they can thin the wafers (through backgrinding and polishing) to the very shallow thicknesses (several mils) required for die stacking ...

  • Wafer and Substrate Thinning Temporary Bonding Wax Coating ...

    Wafer Processing Adhesives. ... BACKGRINDING THINNING TEMPORARY BONDING “IPA-WAX” SPIN-COATING AND ADHESIVE FILM SOLUTIONS for WAFERS and SUBSTRATES. ... AIT technical sales and service department can also be reached at: 1-609-799-9388 or 1-800-735-5040 (EST) and Fax: 609-799-9308 ...

  • A Study of Grinding Marks in Semiconductor Wafer Grinding

    backside by a process called “backgrinding” after construction of circuits on the front side. One phenomenon in wafer grinding is the generation of grinding marks. The depth and the orientation of grinding marks play an important role in determining the quality of the wafer produced.

  • Wafer Sawing - PacTech - Packaging Technologies GmbH

    Wafer dicing is the process by which individual silicon chips (die) are separated from each other on the wafer. The dicing process is accomplished by mechanically sawing the wafer in the extra areas between the die (often referred to as either dicing streets or scribe lines). To facilitate the sawing of the wafer, backside support []

  • Polish, Clean Grinding - Wafer Services - Pure Wafer

    In addition to standard polishing procedures, Pure Wafer also provides a kiss-polishing service, which involves a light and delicate polish to remove minor surface scratches or defects. Pure Wafer possesses single side and double side polishing process capability. Double side polishing produces wafers with the lowest TTV values in the industry.

  • US9390903B2 - Method and apparatus for wafer backgrinding ...

    A workpiece processing apparatus is provided. The apparatus includes a rotary turntable having one or more spindles thereon, the turntable being configured to rotate about a turntable axis. Each of the spindles is configured to receive and secure thereon a workpiece to be processed by the apparatus. Each of the spindles can rotate about their own independent axes.

  • Development of Fully Depleted, Back-Illuminated Charge ...

    In addition, since the wafers must go through photolithography steps, the wafers must be su ciently at after the thinning step. We have investigated a backgrinding and polishing process for wafer thinning. This process is common in the integrated circuits industry and is o ered as a service at various commercial vendors.

  • Wafer Grinding Process Video - EXART

    Wafer Backgrind Wafer Backgrind is the process of grinding the backside of the wafer to the correct wafer thickness prior to assembly. It is also referred to as 'wafer thinning.' Wafer backgrinding has not always been necessary, but the drive to make packages thinner and thinner has made it

  • flexible die back grinding machine

    Wafer backgrinding Wikipedia. Wafer backgrinding is a semiconductor device fabrication step during which wafer thickness is reduced to allow stacking and high density packaging of integrated circuits IC ICs are produced on semiconductor wafers that undergo a multitude of processing steps The silicon wafers predominantly used today have ...

  • glass grinding ag

    PQ Corporation Potters Industries. About Us. Potters Industries LLC, is a leading producer of engineered glass materials serving the oil and gas industry, polymer additives, highway safety, metal finishing, and conductive particle markets.Through its research and technology advancements, Potters has developed product lines that include hollow glass microspheres used as weight-reducing fillers ...

  • grinding inde of li ne - whiskedawaybakery.nl

    Cleaning Polishing amp Grinding Linde Gas. ... Wafer Backgrinding Silicon Wafer Thinning Wafer Backgrind. ... 1 ACCU Pro 632 AUTO INDEX SPIN RELIEF REEL MOWER GRINDER Patent No 6 010 394 6 290 581 amp 6 685 544 ASSEMBLY and SERVICE MAN1 12 WARNING You must thoroughly read and understand this manual.

  • stationary grinding and lapping machine - DBM Crusher

    Hyprez174 Lapping/Polishing Machines and Accessories DoubleSided Grinding and Lapping Machine This doublesided system can be used on a variety of materials to achieve a high degree of accuracy in flatness parallelism and surface finish using either free abrasive slurry or fixed abrasive media. EHG BackGrinding Machines for Advanced Material Wafers

  • Development of Fully Depleted, Back-Illuminated Charge ...

    diameter wafers is a generally lower resistivity achieved to date on the 150 mm material. Typically the range of resistivity seen in 150 mm diameter wafers is 4000 8000 -cm, in contrast to the ...

  • Sanders and Sanding Machines Selection Guide Engineering360

    Sanders and sanding machines are used to finish wood, plastic, or composites through the application of abrasive belts, discs, or sheets. There are many different types of products, including two main types of belt sanders: contact-wheel and edge. Contact-wheel belt sanders consist of a driven ...

  • Polishing and Buffing Machines Specifications Engineering360

    Find Polishing and Buffing Machines on GlobalSpec by specifications. Polishers and buffing machines are used to impart a fine (low Ra) surface finish on the exterior of a part. To improve surface finish, they use use abrasive grain slurries or compounds on buffs, bobs, cloth naps, laps, very fine grit nonwovens, and coated abrasives.

  • Aluminum Nitride Alumina Ceramic Substrates, Lapping ...

    Valley Design East Phoenix Park Business Center 2 Shaker Road, Bldg. E-001 Shirley, MA 01464 Phone: (978) 425-3030 Fax: 978.425.3031 Valley Design West Santa Cruz, CA 95060

  • Fused Silica Wafers JGS1, JGS2, JGS3 grades refreactive index

    High quality, Low price fused silica wafers JGS1, JGS2, JGS3 grades are tough with very low thermal expansion. Strong absorbtion in the infrared (IR).

  • Used, Surplus, Refurbished Equipment For Sale, Auctioned ...

    Accretech, UF3000 EX, 300mm, Wafer Probers: Accretech, UF3000 EX, 300mm, Wafer Probers. UF3000EX Automatic Probing System. HARDWARE COMPONENTS * Main Control System (requires 220V service) * Hard Disk Drive * USB port * One Single FOUP Port for 25 Wafers (8 to 12 Inch Wafers) * Manual Wafer Inspection Transfer Unit * Dual Robotic Wafer ...

  • bouch ag 4 grinding machine

    Wafer Backgrinding . Wafer grinding also called wafer thinning is a process performed during the semiconductor manufacturing to reduce wafer thickness This manufacturing step is essential in producing the ultra-thin wafers required for stacking and high-density packaging in portable and handheld devices Silicon Wafer Thinning Processes for the ...

  • Polished Aluminum Nitride (ALN) Wafers, Lapped Alumina ...

    Polished Aluminum Nitride Substrates Pullout-free polished AlN substrates to the tightest thickness and flatness specifications are now available from stock for immediate delivery. Valley has over 25 years of precision lapping and polishing experience.